Advanced silicon photonics platform for high-volume PIC manufacturing
Built on imec’s validated photonics technology and extensive process design kit (PDK), IC-Link delivers reliable photonics IC (PIC) development and supports seamless transitions to volume manufacturing.
Proven pathway to scalable silicon photonic IC manufacturing
IC-Link by imec offers a proven pathway from concept to high-volume production for PICs.
Leveraging imec’s state-of-the-art integrated photonics technology—used for high-volume manufacturing since 2018—IC-Link enables you to turn your breakthrough optical designs into scalable, manufacturable PICs.
Industrial-grade silicon photonics
Through imec’s close collaboration with, and successful technology transfer to a leading advanced commercial PIC foundry, IC-Link provides access to an industrial-grade silicon photonics platform that combines imec’s intellectual property and design ecosystem with high-volume manufacturing expertise.
Continuous PDK innovation
Imec’s PDKs are continuously updated. This ensures that every design remains compatible with evolving elements while benefiting from imec’s ongoing R&D innovation.
Full photonic IC development flow and design enablement
IC-Link supports the full silicon photonics development flow—from design enablement to wafer fabrication, packaging, and testing—allowing customers to focus on differentiation at the system and application level.
Engagements can be structured as turnkey solutions or customized collaborations, providing flexibility to match technical requirements and production goals.
Faster transitions from prototype to volume PIC manufacturing
By bridging imec’s advanced technology platform with commercial foundry infrastructure, IC-Link makes it possible to move efficiently from prototype to volume manufacturing.
With more than a decade of continuous photonics innovation and a strong manufacturing ecosystem, IC-Link helps customers bring the power of light to practical, scalable systems.
Contact IC-Link today to start your PIC journey.
