To meet the rising demands of AI, high-performance computing and memory-intensive applications, traditional chips design approaches are reaching their limits.
Particularly in sectors such as automotive, mobile and telecom, advanced packaging has become a decisive driver of chip innovation.
For ASIC development, this shift requires new levels of collaboration, bringing together design, integration, and manufacturing teams in tightly coupled, iterative development cycles.
That’s where the TSMC 3DFabric® Alliance comes in. By enabling early access to leading 2.5D and 3D technologies, it helps innovators tackle growing semiconductor and system-level design complexity.
By joining the TSMC 3DFabric® Alliance, IC-Link:
Enhances its capabilities in advanced chip integration.
Offers its customers and the expanded 3DFabric® ecosystem the opportunity to leverage its global IC services.
