Need additional support and services with your chip manufacturing? By utilizing its partner network, imec offers you a complete range – from design to product qualification.
IC-Link combines its own team of chip design specialists with those of our design partner network to tailor the design team depending on the needs of your application and taking into account your entry point in the design flow.
We are also your access point to an extensive IP partner network as well as selected imec IP, providing solutions for many markets in a broad range of technologies.
IC-Link provides prototype and volume packaging through leading assembly houses. Our team and partners can support a wide range of packaging options ranging from wire bond to flip-chip and 2.5D/3D package designs.
Our team will work with you to identify the optimal packaging solution based on your requirements and then design and manufacture the targeted package.
To test your chips, test software and hardware are developed through IC-Link partners. For certain technologies, we also offer full qualification services, covering a range of qualification requirements (consumer, industrial, medical, space).
After successful corner lots, volume risk production can start with yield monitoring and improvement during the ramp-up phase. And once your chip is qualified and running in high volumes, the test solution can be transferred to low-cost test houses.
From just buying processed wafers to fully outsourcing the supply chain and purchasing fully qualified, tested and assembled chips, the choice is yours. We offer everything from:
Failure analysis and troubleshooting quickly get to the root cause of any problem and ensure a successful transition to volume production. During the product lifecycle, the business model can be adapted to meet changing requirements.
You can choose any combination of services to complement your in-house skills and capabilities. Ask us for a tailored proposal.