Your access to innovative chip manufacturing
Leverage imec’s expertise and ecosystem to fabricate your advanced chips in CMOS up to advanced nodes, silicon photonics, and specialty technologies and sensors.
Process technology selection
The starting point for any design is selecting the right process technology node for the manufacturing of your chip.
Our skilled IC-Link team helps you make the technology choice that best fits your technical and market requirements. And subsequently provides you with the corresponding design kit and cell libraries so you can create your chip layout.
ASIC manufacturing in CMOS
As a leading TSMC Value Chain Aggregator (VCA), imec offers you access to an extensive range of mature and cutting-edge technologies. And as a main partner of Europractice we also support technologies from other foundries, such as X-FAB and UMC. Along with the variety of technologies, you can choose from a range of options – including FinFET logic, embedded memory, mixed signal as well as other dedicated processes for power devices and image sensors.
All this comes with the proven, high-quality production guarantee that you can expect from foundry partners leading in semiconductor industry.
Silicon photonics
IC-Link offers silicon (Si)-based Photonic Integrated Circuit (PIC) fabrication through dedicated runs or multi-project wafer services. Our Si-based process is optimized for applications such as data center interconnects and high-speed transceivers with a large active component library.
ISIPP50G platform
Specialty technologies and sensors
Does your innovation require a process that lacks a standard flow? Do you want to integrate custom sensors on your chip? IC-Link offers you the opportunity to bring your device to maturity in imec’s cleanrooms, up to prototyping and low-volume manufacturing. Because of the compatibility of imec’s tools with those in major foundries, your manufacturing proces can then be transferred to high-volume fabrication.
GaN-IC
Imec’s unique GaN-on-SOI technology provides full isolation between power devices, drivers, control and protection circuits. This enables the fabrication of complex single-chip GaN power ICs.
Compared to traditional silicon-based processing, innovative compound semiconductor processes offer higher power density and faster switching capabilities in very small form factors. Imec’s 100V and 650V GaN-on-SOI technology is offered through Europractice in the form of a multi-project wafer service.
Schematic cross-section of monolithically integrated half-bridge with enhancement mode low-side and high-side devices fabricated on 200 mm GaN-on-SOI with trench isolation.
Work with us
Want to discuss your chip manufacturing needs? Don’t hesitate to get in touch.