Will chiplets become the new standard in chip design? This modular approach, combining smaller dies into a single integrated circuit, is gaining serious momentum. The benefits are compelling:
- higher yield when monolithic dies become too large
- heterogeneous integration of functionally optimized blocks
- greater modularity and design reusability
But chiplets aren’t a one-size-fits-all solution. They also introduce challenges, such as:
- architectural complexity
- testing hurdles
- latency and bandwidth issues
To sum up, the chiplet approach is not a magic bullet. It’s another tool in the chip designer’s toolbox. Deciding whether to use it requires careful trade-off analysis.
In this article on ElectronicDesign.com, IC-Link experts break down when and why chiplets make sense, and when they don’t. You’ll learn:
- What’s driving the chiplet trend.
- The engineering challenges that come with it.
- How to decide based on your application.
Published on:
7 August 2025
