ISiPP300 integrated photonics platform
In the age of AI and high-performance computing, there’s only one way to successfully address the datacenter interconnect market: obtain access to a highly advanced integrated photonics platform.
Through its optical interconnects research program, imec is a forerunner in scaling performance using fully CMOS-compatible silicon-based optical links. The resulting 300mm imec silicon photonics platform (iSiPP300) with mature building blocks is now available for prototyping and manufacturing through IC-Link.
Discover more about the state-of-the-art devices on our PDK and how IC-Link lets you go from idea to manufacturing.
Advanced features
ISiPP300 includes all standard building blocks from iSiPP200, and adds advanced options enabled by state-of-the-art process and tools in imec’s 300mm cleanroom:
- Advanced tools and immersion lithography enable smaller dimensions for higher-performing devices such as ring modulators with uniform resonance wavelength over wafer, 100nm broadband directional couplers and sub-dB-loss grating couplers.
- Advanced 3D options include through-silicon vias (TSV) and microbumps.
- Cost-efficiency improves: thanks to the larger wafer size, more dies will fit onto 300mm wafers compared to 200mm wafers.
TSV integration in iSiPP300.
iSiPP300 device library
A complete and regularly updated PDK lets you start designing immediately on the iSiPP300 platform. The technology supports 200Gbps per lane and available devices include:
Passive devices
- High-precision waveguides through advanced lithography (193nm immersion)
- PECVD and LPCVD silicon nitride (SiN) waveguides
- Undercut structuresµ
- Single-mode-fiber (SMF) grating couplers, broadband directional couplers, and edge couplers (with undercut)
- Silicon nitride as optical interposers
Active devices
- Silicon ring modulators
- GeSi electro-absorption modulators
- Silicon Mach-Zehnder modulators
- Ge photodetectors
Microring modulator resonant wavelength wafer-scale distribution.
3D/back-end features
- Cu-Ni-Sn under-bump metallization (UBM)
- Up to 4 metal layers
- Through-silicon vias (TSVs)
- Microbumps
Services
The iSiPP300 platform is available directly via UMC or through imec for prototyping and manufacturing. We offer services to help you focus on your core expertise and accelerate time to market:
- Design
- Tape-out
- Manufacturing
- Testing
- Supply chain for low volumes
Ready to discuss your advanced integrated photonics project? Click the contact button below to schedule a meeting with our team.