
Accelerate AI silicon development with imec’s advanced platform based on foundry PDKs, delivering the performance, efficiency, and scalability demanded by modern AI chips.
IC-Link enables the next generation of artificial intelligence (AI) through custom ASICs that deliver the power, performance, and efficiency that AI demands.
Building on imec’s deep heritage in CMOS technology and system integration, IC-Link provides full-turnkey ASIC development—bridging early design concepts to qualified silicon in production.

AI applications demand devices with higher compute density, bandwidth, and energy efficiency. IC-Link helps you meet these challenges by providing access to advanced CMOS process technologies (down to N2), through imec’s long-standing partnership with TSMC and other leading foundries.
This enables development through high-volume manufacturing of optimized architectures for data centers, high-performance computing, and other AI applications.
Through comprehensive design enablement, IP integration, packaging, and testing, IC-Link ensures that every design is tuned for performance, yield, and manufacturability.
Our flexible engagement models support both turnkey ASIC delivery and collaborative engineering models, allowing you to balance innovation and control throughout your development cycle.

IC-Link’s technology portfolio, combined with imec’s advanced R&D in semiconductor scaling and system-level co-design, offers a unique bridge between cutting-edge research and industrial-scale production—while ensuring your IP is protected.
By aligning silicon capabilities with AI workloads, IC-Link helps you achieve the performance and efficiency you need—whether you’re a startup or a global provider—to deploy smarter, faster, and more sustainable AI ASIC solutions.
To learn more, watch our latest webinar on ASICS for AI
When you’re ready to accelerate your next AI project from development to completion, contact IC-Link.