Designing a 2.5D heterogeneous integration platform involves integrating multiple dies onto a silicon interposer, requiring efficient signal and power routing. Signal routing minimizes delays, crosstalk, and ensures reliable communication, while power routing delivers stable and sufficient power. Electrical performance analysis assesses signal integrity, timing, and power distribution. High-speed interfaces demand optimized routing for impedance control and transmission line effects. Sign-off involves verifying interconnects, signal integrity, power integrity, and timing closure. Advanced simulation, electromagnetic analysis, and physical design verification are employed for validation. Collaboration among design teams is crucial for successful integration and reliable operation of the 2.5D heterogeneous integration platform. This increased collaboration brings with it challenges and risks. During the design, Cadence Integrity 3D-IC software was used to mitigate these risks and design implementation. Verification was done using Voltus and System LVS.
