Building the silicon foundation for Europe’s AI future

AI workloads are making ever-higher demands on custom chips. To make sure hardware can keep up with AI growth, innovation is needed across multiple dimensions:

• Moving to ASICs in the most advanced CMOS nodes.
• Leveraging photonic integrated circuits (PICs) for bandwidth scaling.
• Shifting from monolithic to modular (chiplet) architectures, enabled by advanced 2.5D/3D packaging.

Ensuring that European companies, regardless of size or initial production volume, can access these technologies is critical to their future competitiveness. This is precisely where IC-Link by imec plays a vital role.

As a side event to the GSA European Executive Forum, IC-Link is organizing a partner ecosystem networking session to foster exchange on practical pathways to next-generation AI hardware.

I want to attend

This partner networking session will:

• Provide keynote insights on topics spanning from advanced CMOS scaling to integrated photonics, and 2.5D/3D integration.
• Highlight Europe’s opportunity and potential to address increasing AI demand.

Agenda

More details about the program will be announced soon.

Venue

This partner networking event will take place at the Maritim Hotel, near the station, and a short walk from the GSA European Executive Forum venue.

Do you also want to attend the GSA European Executive Forum? You can register for the event at a discount price. Use one of these promotion codes when registering on their website:

• Conference only: use code 26EEF-imec
• Conference with VIP dinner: use code 26EEF-imecdinner
   

Request to join

To ensure a balanced representation across companies, sectors and participants, we can only confirm your registration, by email, after we review your submission.