/TSMC Open Innovation Platform® Ecosystem Forums

TSMC Open Innovation Platform® Ecosystem Forums

26 - 27 October 2021 | Online

The TSMC Open Innovation Platform® Ecosystem Forum is a one-of-a-kind event that brings together the semiconductor design chain community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with a virtual Ecosystem Pavilion. The Forum provides the ideal venue to build relationships with TSMC customers.

Technical sessions at all three OIP Ecosystem Forums are organized in one to three tracks focusing on Mobile & Automotive, High-Performance Computing & 3DIC, and IoT & RF, with each track covering multiple half-hour presentations.

Key benefits of participating in TSMC's OIP Ecosystem Forum are:

  • One-on-one exclusive access to hard-to-reach TSMC customer director-level and above executives
  • More in-depth dialogue with TSMC customers around the world

All events start at 9:30 am local time (Pacific Daylight Time, China Standard Time, Central European Time)


  • North America, 26 October – imec.IC-link virtual booth
  • China, 27 October – imec.IC-link virtual booth
  • Europe, 27 October – joined imec and imec.IC-link virtual booth and an imec’s talk on “High-resolution radar and smart sensor fusion for robotics”

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