February 1, 2027 | Sunnyvale, USA
Scaling Integrated Photonics Throughout the AI Data Center
IC-Link and imec will be at PIC Summit USA 2027, that connects North America's growing integrated photonics community with leading customers, experts, investors, and technologies from around the world. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging. Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link.
PRESENTATION
''Scaling PICs: Manufacturing, Packaging & Testing'': ~11:40-12:15 (exact time TBC), Philippe Absil, VP IC-Link