PIC International 2026

IC-Link and imec will be participating in PIC International 2026, where the key decision makers from the whole of the PIC supply chain, from materials and equipment suppliers, foundries and advanced packaging houses, module and subsystem supplies, all the way to OEM and equipment makers, come together. 

IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging. 
Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link.

BOOTH on our Silicon photonics offering

PRESENTATION

"New Materials for Enabling High-performance Photonic Devices and Emerging Applications"
April 21, 11:45 a.m.
by Leili Shiramin, Portfolio Manager