ISIG Executive Summit USA 2026
April 20 - 21, 2026 | Sunnyvale, USA
Scaling AI: Hardware innovation, compute acceleration and next-gen infrastructure
IC-Link and imec will be participating in ISIG Executive Summit USA, an event that brings together the visionaries driving breakthroughs in manufacturing, packaging, photonics, data centers, and silicon platforms.
PANEL
Co-Packaged Optics: Innovations, Scaling Challenges and Deployment Roadmap
April 20, 1:50 - 2:45 p.m.
Panel moderator: Philippe Absil, Vice President IC-Link, silicon solutions