2026 TSMC North America OIP Ecosystem Forum
September 23, 2026 | Santa Clara, USA
Expanding AI with Leadership Ecosystem
IC-Link and imec will be participating in 2026 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss turning visionary ideas into reality. Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:
BOOTH #420
- TSMC Value Chain Alliance (VCA) member
- TSMC 3DFabric© Alliance Member
- TSMC Design Center Alliance (DCA) Member
PRESENTATIONS
Coming soon!