North America

Universities in North America can now gain access to the TSMC University FinFET Program. This newly developed program offers advantageous pricing for TSMC FinFet technologies.

Program highlights

  • Offering the industry’s most successful FinFET technology family to universities
    • Starting with N16, N7 (including RF)
    • Tapeout and manufacturing services
  • Design collaterals for both teaching and research
    • N7 and N16 design collateral: For test chip MPW
    • N16ADFP (academic design foster package): For teaching purposes only


To access the TSMC University FinFET program, please, fill in the application form and return it to

Application form