North America
Universities in North America can now gain access to the TSMC University FinFET Program. This newly developed program offers advantageous pricing for TSMC FinFet technologies.
Program highlights
- Offering the industry’s most successful FinFET technology family to universities
- Starting with N16, N7 (including RF)
- Tapeout and manufacturing services
- Design collaterals for both teaching and research
- N7 and N16 design collateral: For test chip MPW
- N16ADFP (academic design foster package): For teaching purposes only
Access
To access the TSMC University FinFET program, please, fill in the application form and return it to ic-link.na@imec-int.com