/Webinar: How to integrate readout electronics in next-generation tools for genomics

Webinar: How to integrate readout electronics in next-generation tools for genomics

October 7, 2021 | 11-12 AM EDT, 5-6 PM CEST

Nick Van Helleputte, R&D Manager Biomedical Circuits and Systems 
Romano Hoofman, Program Director imec.IC-link

Abstract

Equipment to study the genome is often used in labs or dedicated facilities where tool size is not really an issue. In many cases, the readout electronics is an ‘external’ relatively large computer unit, packed inside the tool.

For future systems focus is on higher throughput (i.e. more sensors), smaller size and lower cost which translates into the integration of the readout electronics inside the system.

This is beneficial for different reasons. First of all, the system performance will increase by integrating the readout electronics close to the sensors. Second, it allows to use large arrays of sensors. And thirdly, it improves the signal-to-noise ration and the bandwidth.

In this webinar, we will talk about the enormous potential of specially designed chips, so-called ASICs, for the readout electronics. These form the base on which the sensors, photonics and microfluidics are post-processed to manufacture a fully integrated solution.

We will stress the importance of co-developing the design of readout electronics and sensors. To realize future concepts, experts of these different disciplines need to work together.

Speakers

Romano Hoofman

Romano Hoofman is Program Director at imec.IC-link since 2016. He is currently responsible for the innovation programs of the unit and for the coordination of the EUROPRACTICE Service.
He started his career in industry, where he worked as a Principal Scientist at Philips Research and later on NXP Semiconductors. He covered many different R&D topics, ranging from CMOS integration, advanced packaging, thin-film batteries, photovoltaics and (bio)sensors.
Romano received his PhD from the Technical University of Delft in 2000, where he investigated charge transport in semi-conducting polymers. He has authored more than 30 publications and holds more than 10 patents in various research areas.

Nick Van Helleputte

Nick Van Helleputte received his MSc degree in electrical engineering in 2004 from the KU Leuven, Belgium. He received his PhD from the same university in 2009 (KU Leuven MICAS research group). His PhD research focused on low-power ultra-wide-band analog front-end receivers for a wide range of applications. He joined imec in 2009 as an Analog R&D Design Engineer. He is currently R&D manager of the connected health solutions team. His research focus is on ultra-low-power circuits for biomedical applications. He has been involved in analog and mixed-signal ASIC design for wearable and implantable healthcare solutions. Nick is an IEEE member and served on the technical program committee of VLSI circuits symposium and ISSCC.